News & Events

Keep up with the latest news, events and highlights related to the TEMPO project and the neuromorphic community. Thank you for following, participating, and getting involved!

European Forum for Electronic Components and Systems
24 - 25.11.2022

European Forum for Electronic Components and Systems

Visit the TEMPO booth at the EFECS exhibition! EFECS is the international forum with a focus on ‘Our Digital Future’ for a green and competitive Europe along the Electronic Components and Systems value chain in Europe.

Semicon Europa
15 - 18.11.2022

Semicon Europa

SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

Biomedical Circuits And Systems
13 - 15.10.2022

Biomedical Circuits And Systems

BioCAS 2022 is a premier international forum for presenting the interdisciplinary research and development activities at the crossroads of medicine, life sciences, physical sciences and engineering that shape tomorrow’s medical devices and healthcare systems.

Solid State Devices and Materials
26 - 29.09.2022

Solid State Devices and Materials

SSDM is one of the most reputable international conferences on the science and technology of devices and materials.

European Microwave Week
25 - 30.09.2022

European Microwave Week

EuMW 2022 provides access to the very latest products, research and initiatives in the microwave sector.

European Solid-State circuits/device Conference
19 - 22.09.2022

European Solid-State Circuits & Device Research Conference

Join the TEMPO workshop "Embedded Artificial Intelligence (EAI) - Devices, Systems and Industrial Applications", which is part of the ESSCIRC ESSDERC 2022 conference. The aim of this conference is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.

19.09.2022

Watch the EAI workshop video

The International Workshop on Embedded Artificial Intelligence (EAI) - Devices, Systems, and Industrial Applications is part of the ESSCIRC ESSDERC 2022 European Solid-state Circuits and Devices Conference held in Milan, Italy. The EAI workshop is co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE, and TEMPO, to provide a platform to exchange knowledge and ideas among experts and professionals interested in advances in AI circuits and device design, AI hardware architectures, industrial edge AI technologies, toolchains, and applications.

ValleyML ai
09 - 17.08.2022

ValleyML.ai

ValleyML presents a unique combination of AI Technology, researchers, industry elites and prospective clients in one single iconic event. It’s the ideal platform for innovative engineers, marketing veterans, business leaders, decision makers, media analysts and investors looking to generate buzz and network.

05.08.2022

EAI4IA workshop publications are available in an open access book

The International Workshop on Edge Artificial Intelligence for Industrial Applications (EAI4IA) was a great success. All publications have been bundled in an open access book and can be checked out here.

International Joint Conference on Artificial Intelligence
23 - 29.07.2022

International Joint Conference on Artificial Intelligence

Joint the TEMPO workshop at IJCAI, the premier international gathering of researchers in AI!

25 - 26.07.2022

Watch the EAI4IA workshop video

The International Workshop on Edge Artificial Intelligence for Industrial Applications (EAI4IA) brings together researchers and practitioners working on providing edge artificial intelligence methods, techniques and tools to augment industrial applications. EAI4IA comprises technical presentations, keynotes and panel discussions focusing on industrial-edge AI hardware, software and AI frameworks.

25 - 26.07.2022

International Workshop on Edge Artificial Intelligence for Industrial Applications

The EAI4IA workshop aims to create opportunities to stimulate research and innovation in the emerging domain of industrial edge AI. It is co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE and TEMPO.

Semicon West
12 - 14.07.2022

Semicon West

SEMICON West 2022 is a flagship conference for the microelectronics supply chain.

Medical Imaging with Deep Learning
06 - 08.07.2022

Medical Imaging with Deep Learning

MIDL is a forum for deep learning researchers, clinicians and health-care companies working at the intersection of machine learning and medical image analysis.

International Conference on Information Fusion
04 - 07.07.2022

International Conference on Information Fusion

The International Conference on Information Fusion has long been recognised as a premier forum for researchers and practitioners to exchange ideas in the field of information fusion and its impacts on our society.

09.06.2022

TEMPO AI chip tapes out with videantis processor platform

Videantis GmbH announced the tape-out of a low-power AI chip, embedding its unified processing platform. Fraunhofer-IIS contributed to this design in the frame of the TEMPO research project. Together with automotive application partners Valeo and InnoSenT, this chip will accelerate deep learning inference for automotive applications requiring small silicon footprint and low power consumption.

Future Summits
17 - 18.05.2022

Future Summits

Imec’s flagship event on nanoelectronics advances & deeptech solutions.

Cognitive Neuromorphic Engineering Workshop
01 - 15.05.2022

Cognitive Neuromorphic Engineering Workshop

The mission of CapoCaccia is to understand the principles of biological intelligence, and to implement these in neuromorphic technologies, for the good of all mankind.

22.06.2020

Stromsparende Chips für Künstliche Intelligenz

The Fraunhofer Institutes EMFT, IIS and IPMS are doing research on energy-efficient neuromorphic hardware.

02.07.2019

How to get a server rack in your back pocket?

Imec presents EU project TEMPO targeting low-power chips for AI applications based on emerging memory technologies.