Medical Imaging with Deep Learning

Join the TEMPO workshop "Embedded Artificial Intelligence (EAI) - Devices, Systems and Industrial Applications", which is part of the ESSCIRC ESSDERC 2022 conference. The aim of this conference is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.

The International Workshop on Edge Artificial Intelligence for Industrial Applications (EAI4IA) was a great success. It was co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE and TEMPO. All workshop publications have been bundled in an open-access book and can be checked out here.

ValleyML presents a unique combination of AI Technology, researchers, industry elites and prospective clients in one single iconic event. It’s the ideal platform for innovative engineers, marketing veterans, business leaders, decision makers, media analysts and investors looking to generate buzz and network.

EuMW 2022 provides access to the very latest products, research and initiatives in the microwave sector.

SSDM is one of the most reputable international conferences on the science and technology of devices and materials.

BioCAS 2022 is a premier international forum for presenting the interdisciplinary research and development activities at the crossroads of medicine, life sciences, physical sciences and engineering that shape tomorrow’s medical devices and healthcare systems.

SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

Visit the TEMPO booth at the EFECS exhibition! EFECS is the international forum with a focus on ‘Our Digital Future’ for a green and competitive Europe along the Electronic Components and Systems value chain in Europe.

Joint the TEMPO workshop at IJCAI, the premier international gathering of researchers in AI!

The EAI4IA workshop aims to create opportunities to stimulate research and innovation in the emerging domain of industrial edge AI. It is co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE and TEMPO.

SEMICON West 2022 is a flagship conference for the microelectronics supply chain.

The International Conference on Information Fusion has long been recognised as a premier forum for researchers and practitioners to exchange ideas in the field of information fusion and its impacts on our society.

Videantis GmbH announced the tape-out of a low-power AI chip, embedding its unified processing platform. Fraunhofer-IIS contributed to this design in the frame of the TEMPO research project. Together with automotive application partners Valeo and InnoSenT, this chip will accelerate deep learning inference for automotive applications requiring small silicon footprint and low power consumption.

Imec’s flagship event on nanoelectronics advances & deeptech solutions.

The mission of CapoCaccia is to understand the principles of biological intelligence, and to implement these in neuromorphic technologies, for the good of all mankind.

The Fraunhofer Institutes EMFT, IIS and IPMS are doing research on energy-efficient neuromorphic hardware.

Imec presents EU project TEMPO targeting low-power chips for AI applications based on emerging memory technologies.