ITF World

The TEMPO research project presented its key outcomes during the final review meeting. A magnificent consortium paved the way towards embedded AI by developing innovative neuromorphic technologies. The coordinator Björn Debaillie values the excellence of the entire consortium and the support of KDT JU with the national authorities. As an impactful pioneer, the TEMPO research project broadens the applicability and strengthens the European ecosystem of embedded neuromorphic computing.

The TEMPO research project is ready for its final review event on 25-26 January. We welcome Georgi Kuzmanov from the European Commission and the experts Fredrik Dahlgren and Christian de Prost at imec to enjoy our presentations, exhibition, and much more.

The TEMPO consortium drove a worldwide dissemination effort to ensure the largest possible visibility and impact of the project findings and to support the widest adoption of its results in the broad microelectronics ecosystem.

The TEMPO final review meeting will be hosted by imec in Leuven on 25-26 January 2023.

Visit the TEMPO booth at the EFECS exhibition! EFECS is the international forum with a focus on ‘Our Digital Future’ for a green and competitive Europe along the Electronic Components and Systems value chain in Europe.

SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

BioCAS 2022 is a premier international forum for presenting the interdisciplinary research and development activities at the crossroads of medicine, life sciences, physical sciences and engineering that shape tomorrow’s medical devices and healthcare systems.

SSDM is one of the most reputable international conferences on the science and technology of devices and materials.

EuMW 2022 provides access to the very latest products, research and initiatives in the microwave sector.

Join the TEMPO workshop "Embedded Artificial Intelligence (EAI) - Devices, Systems and Industrial Applications", which is part of the ESSCIRC ESSDERC 2022 conference. The aim of this conference is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.

The International Workshop on Embedded Artificial Intelligence (EAI) - Devices, Systems, and Industrial Applications is part of the ESSCIRC ESSDERC 2022 European Solid-state Circuits and Devices Conference held in Milan, Italy. The EAI workshop is co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE, and TEMPO, to provide a platform to exchange knowledge and ideas among experts and professionals interested in advances in AI circuits and device design, AI hardware architectures, industrial edge AI technologies, toolchains, and applications.

ValleyML presents a unique combination of AI Technology, researchers, industry elites and prospective clients in one single iconic event. It’s the ideal platform for innovative engineers, marketing veterans, business leaders, decision makers, media analysts and investors looking to generate buzz and network.

The International Workshop on Edge Artificial Intelligence for Industrial Applications (EAI4IA) was a great success. All publications have been bundled in an open access book and can be checked out here.

Joint the TEMPO workshop at IJCAI, the premier international gathering of researchers in AI!

The International Workshop on Edge Artificial Intelligence for Industrial Applications (EAI4IA) brings together researchers and practitioners working on providing edge artificial intelligence methods, techniques and tools to augment industrial applications. EAI4IA comprises technical presentations, keynotes and panel discussions focusing on industrial-edge AI hardware, software and AI frameworks.

The EAI4IA workshop aims to create opportunities to stimulate research and innovation in the emerging domain of industrial edge AI. It is co-organised by three large-scale ECSEL JU projects: AI4DI, ANDANTE and TEMPO.

SEMICON West 2022 is a flagship conference for the microelectronics supply chain.

MIDL is a forum for deep learning researchers, clinicians and health-care companies working at the intersection of machine learning and medical image analysis.

The International Conference on Information Fusion has long been recognised as a premier forum for researchers and practitioners to exchange ideas in the field of information fusion and its impacts on our society.

Videantis GmbH announced the tape-out of a low-power AI chip, embedding its unified processing platform. Fraunhofer-IIS contributed to this design in the frame of the TEMPO research project. Together with automotive application partners Valeo and InnoSenT, this chip will accelerate deep learning inference for automotive applications requiring small silicon footprint and low power consumption.

Imec’s flagship event on nanoelectronics advances & deeptech solutions.

The mission of CapoCaccia is to understand the principles of biological intelligence, and to implement these in neuromorphic technologies, for the good of all mankind.

The Fraunhofer Institutes EMFT, IIS and IPMS are doing research on energy-efficient neuromorphic hardware.

SynSense joins forces with IMEC, CEA-LETI, Fraunhofer, Philips, ST Microelectronics and others, to bring its neuromorphic computing technology to power-hungry mobile devices for real-time local processing.

Imec presents EU project TEMPO targeting low-power chips for AI applications based on emerging memory technologies.